Hero Fair Limited

We are semiconductor experts in the China market. We specialised in Thin Wedge Bonding, Heavy Wire Bonding, Dicing, Die Attach, Ball Bonding, Plasma Cleaning and other semiconductor process.

Hero Fair,Dicing saw,Single spindle,Twin spindle,Wafer mounter,UV system,Wafer cleaner,Wafer cleaning system,Dicing blade,Nickel blade,Resin blade,sintered blade,Hub blade,Wire bonding,Wedge bonding,Heavy wire bonding,Twin head bonder,Battery bonder,R&D wire bonder,Ribbon bonding,Gold wire wedge bonding,Al wire bonding,Aluminium wire bonding,Cu wire bonding,Copper wire bonding,Heavy ribbon bonding,Automation,Bond Head,Cutter,Wire guide,Plasma cleaning,Plasma cleaner,Microwave plasma,LED UV,Bond tester,Pull tester,Shear tester,Die shear tester,Die bonder,Wedge,Thin wire wedge,Heavy wire wedge,Tap tool,Ribbon wedge,Ceramic tip wedge,Al wire wedge,Aluminium wire wedge,Au wire wedge,Gold wire wedge,automation,Loader unloader,Fully automatic indexing system,Line automation,Battery integrated line,Dispenser,英展,切割机,单轴切割机,双轴切割机,晶圆贴片机,紫外线清洗,晶圆清洗机,切割刀片,镍刀片